Cadence.com will be under maintenance from Friday, Oct. 3rd at 6pm (PST) thru Sunday, Oct 5th at 11pm (PST).
Cadence.com login, registration, community posting and commenting functionalities will be disabled.
Home > Community > Tags > lithography/advanced node
 
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more convenient.

Register | Membership benefits
Get email delivery of the Cadence blog (individual posts).
 

Email

* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Comments: *

lithography,advanced node

  • GLOBALFOUNDRIES at CDNLive: Why 10nm Requires Design Technology Co-Optimization

    It's not too early to start thinking about the 10nm process node and beyond - but such advanced process nodes will require a significant change in the semiconductor design ecosystem, according to Jongwook Kye, fellow for lithography modeling and architecture at GLOBALFOUNDRIES. At the recent CDNLive...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Apr 29 2013
  • “In Design” DFM Signoff – the Inside Story

    As noted in a recent customer announcement with Fujitsu, Cadence offers "in design" design for manufacturability (DFM) signoff for digital, mixed-signal and custom IC design. The basic idea is simple - engineers run signoff DFM checks during the physical design process, instead of waiting until...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 5 2011
  • 28 nm IC Design: The Devil Is In The Details

    Smaller process technologies are enticing chip makers with bigger rewards from their end products. The shorter gate lengths at 28nm promise faster transistor speeds and less leakage power, and can double the amount of the logic that can be put into the same die area. Most importantly, however, more die...
    Posted to Digital Implementation (Weblog) by Nora on Mon, Mar 14 2011
  • How DRC Plus Makes DFM Easy at 28nm

    Design for manufacturability (DFM) requirements have been a barrier for many design teams who are thinking about moving to lower process nodes. But can DFM actually get easier as process nodes shrink? That possibility is offered by DRC Plus (DRC+), a new technology developed by GLOBALFOUNDRIES in collaboration...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Oct 25 2010
  • 45 nm Is Turning Point For Model-Based DFM

    A recent decision by TSMC to require model-based design for manufacturability (DFM) checks at 45/40 nm may push DFM into more widespread use. It’s coming too late for the several dozen DFM startups that were around a few years ago, but it could have a significant impact on IC design flows going...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 4 2009
Page 1 of 1 (5 items)