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industry insights,Qualcomm
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User Interview: How ECO Handling Works With Equivalence Checking
Vishvabhusan Pati is a senior staff engineer and manager at Qualcomm , where he’s involved in design work and formal and semi-formal design verification. In this Q&A interview, he discusses advantages and limitations of formal equivalence checking, and describes his experience with automated...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Nov 19 2009
A Qualcomm Perspective on 3D ICs
3D integration is a promising new technology that can potentially save space and power by stacking die in 3 dimensions. I recently spoke with Riko Radojcic, Qualcomm design lead for TSS (Through Silicon Stacking – Qualcomm’s term for 3D ICs), about how Qualcomm is deploying this technology...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Apr 20 2009
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