Log In
|
Register
|
Resource Library
|
Worldwide
Asia-Pacific
|
China
|
EMEA
|
India
|
Israel
|
Japan
|
Korea
|
Taiwan
|
Global Office Locator
Solutions
Products
Services
Support & Training
Alliances
Community
About Cadence
Solutions:
Design IP
Mixed-Signal
Low-Power
Advanced Node
3D-IC
Enterprise Verification
Hosted Design
System Development Suite
Solutions Home
Products for:
System Design and Verification
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Manufacturability Signoff
More Products
OrCAD Products
Sigrity Technologies
Design IP
Verification IP
IP Catalog
Products A-Z
Products Home
Capabilities and Practices
Methodology Services
Design Services
DFM Services
Educational Services
Programs
SOI Design Hub
Services Home
Support
Support Offerings
Support Process
Cadence Online Support
Software Downloads
Computing Platform Support
University Software Program
Training
Training Options
Training Course Catalogs
Support & Training Home
Programs and Initiatives
System Realization Alliance
Foundry Program
ChipEstimate.com - Chip Planning Portal
Connections Program
Verification Alliance Program
Channel Partner (VARs) Program
Power Forward Initiative
Standards and Languages
PCB Service Bureaus
Industry Memberships
Alliances Home
Communities
Industry Insights Blog
Low Power Blog
Mixed-Signal Design Blog
System Design and Verification
Cadence IP Blog
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Quicklinks
All Blogs
All Forums
Community Search
CDNLive User Conferences
Community Home
EDA Vision
Visit the EDA360 microsite
News and Events:
Newsroom
Events and Webinars
Resources:
Customer Success
Newsletters
Publications
Multimedia Center
Logos
Company Info:
Investor Relations
Executive Team
Careers
Contact Us
About Cadence Home
Home
>
Community
>
Tags
> industry insights/IBM/Double Patterning/design rules
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more conveniennt.
Register
|
Membership benefits
Get email delivery of the Cadence blog (individual posts).
Industry Insights
Low Power
Mixed-Signal Design
System Design
and Verification
Cadence IP Blog
Functional Verification
Logic Design
Digital Implementation
Custom IC Design
RF Design
PCB Design
IC Packaging and SiP Design
Manufacturability Signoff
All Blog Categories
Popular Tags
Allegro
Analog
ARM
cadence
DAC
Digital Implementation
e
EDA360
encounter
ESL
functional verification
Incisive
industry insights
Low power
Mixed-Signal
OVM
PCB
PCB design
Specman
System Design and Verification
SystemC
TLM
UVM
Verification
Virtuoso
Browse All Tags
Email
*
Required Fields
Recipients email
*
(separate multiple addresses with commas)
Your name
*
Your email
*
Message
*
Send yourself a copy
Share
Twitter
Facebook
LinkedIn
Google+
Subscribe
RSS
Cadence RSS Feeds
Cadence Press Releases
System Design and Verification Blog
Functional Verification Blog
Digital Implementation Blog
Custom IC Design Blog
RF Design Blog
PCB Design Blog
IC Packaging and SiP Design Blog
Manufacturability Signoff Blog
All Blogs
System Design and Verification Forum
Functional Verification Forum
Digital Implementation Forum
Custom IC Design Forum
Custom IC SKILL Forum
Logic Design Forum
RF Design Forum
PCB Design Forum
PCB SKILL Forum
IC Packaging and SiP Design Forum
Manufacturability Signoff Forum
Intro copy of the newsletter section here, some intro copy of the newsletter. Instruction of how to subscribe to this newsletter.
Contact Us
Cadence Contacts
Community Relations
Customer Support
Employment
Investor Relations
Media Relations
Training
Global Office Locator
Find Offices worldwide
»
Sales Inquiry
Request for Product information
»
Cadence Channel Partners
»
Corporate Headquarters
Cadence Design Systems, Inc.
2655 Seely Avenue
San Jose, CA 95134
Phone: 408.943.1234
*
Required Fields
First Name
*
Last Name
*
Email
*
Company / Institution
*
Comments:
*
Send Yourself A Copy
industry insights,IBM,Double Patterning,design rules
10nm
14 nm
14nm
14nm tapeout
14SOI
20 nm
20nm
3D
Altos
Analog
ARM
ARM Techcon
Barkley
BSIM
Cadence
circuit designers
CMOS
collaboration
color-aware
colorization
colors
common platform
Cortex-A7
Cortex-M0
custom
custom methodology
custom/analog
DAC
DFM
digital
DRC
electromigration
EM
Encounter
ETS
EUV
extraction
fin pitches
FinFET
FinFets
Gerousis
interconnect
IP
layout dependent effects
layout designers
LDE
LELE
Liberate
library characterization
Liebman
Liebmann
lithography
mandrel
mixed signal
Mixed-Signal
modgens
NP-complete
OCV
PDK
Physical Verification System
placement
power network analysis
process variability
PVS
QRC
rapid analog prototyping
routability
routing
RTL Compiler
SADP
Samsung
Samta Bansal
self aligned double patterning
sidewall image transfer
signoff
SIT
SOI
SPICE
Stabenow
standard cells
stitching
tapeout
test chip
triple patterning
variation
Variety
video
Virtual Technology Forum
Virtuoso
webinar
Yeric
Cadence, ARM, Samsung 14nm Test Chip – Collaboration Eases FinFET Digital Implementation
A recent test chip tapeout using the Samsung 14nm FinFET process revealed significant progress in digital implementation at this new process node. Thanks to deep collaboration and extensive R&D investments in libraries, process, and tools, the digital implementation of the test chip was successfully...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Jan 7 2013
ARM TechCon: Design at 14nm (or 10nm) – What’s Going to Change
The next semiconductor process node after 20nm promises tremendous power and performance benefits, but also poses some new challenges, according to a presentation by ARM and IBM at the ARM TechCon conference Oct. 30, 2012. The presentation showed how the "second generation" of double patterning...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Fri, Nov 2 2012
ARM TechCon: Inside Story of a 14nm FinFET Tapeout
The next frontier in semiconductor design is the 14nm process node, and it will come with a new type of transistor, the FinFET. 14nm FinFET technology moved closer to reality at the ARM TechCon conference Oct. 30, 2012, where a Cadence sponsored technical session announced a 14nm test chip tapeout using...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Oct 31 2012
Cadence and IBM Outline 20nm Custom/Analog EDA Flow Requirements
No 20nm IC design "solution" is complete without a custom/analog flow that can develop standard cells and analog/mixed-signal IP blocks. That custom/analog flow requires some changes to keep up with 20nm challenges such as double patterning and layout-dependent effects (LDE). A good overview...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, May 9 2012
On-Line Presentation: 20nm Design Challenges, and a Look Ahead to 14nm
The Common Platform Technology Forum held March 14 in Santa Clara, California, provided an updated look at process technology, design challenges, and ecosystem collaboration at 28nm and below. Much of the content is available throughout 2012 as part of a Virtual Technology Forum . Following is a report...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Mar 19 2012
Video: Easing the Design Challenges of Double Patterning at 20nm
Double patterning lithography will be essential at 20nm and below until at least 2014, according to Lars Liebman, distinguished engineer at IBM. But it need not be a huge burden for engineers. In a talk at the Cadence booth at the Design Automation Conference in June, and newly available in the video...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, Aug 23 2011
Page 1 of 1 (6 items)