Home > Community > Tags > industry insights/EDI/PVS
 
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more conveniennt.

Register | Membership benefits
Get email delivery of the Cadence blog (individual posts).
 

Email

* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Comments: *

industry insights,EDI,PVS

  • TSMC 3D-IC Reference Flow Supports 3D Die Stacking

    An important milestone for any new semiconductor technology is the availability of a foundry EDA reference flow. Such a milestone occurred last week (Sept. 18, 2013) as Cadence and TSMC delivered the latest Cadence 3D-IC reference flow for true 3D die stacking (right). While there has been considerable...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Sep 24 2013
  • Cadence, Samsung Detail 20nm RTL-to-GDSII Methodology

    In a recently archived May 2 webinar , speakers from Cadence and Samsung described a 20nm digital design methodology that can manage challenges such as double patterning, variability, and complexity. The webinar discussed EDA tools, physical IP, and 20nm process technologies, and it highlighted a "proof...
    Posted to Industry Insights (Weblog) by rgoering on Mon, May 7 2012
Page 1 of 1 (2 items)