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industry insights,DFT,Power

  • Si2 DAC Panel: What Standards are Needed for 3D-ICs?

    3D-ICs with through-silicon vias (TSVs) are not yet in volume production, but work has already begun on design standards - and more work is needed soon. An excellent update on work in progress, and a discussion of what's needed, was provided at a Silicon Integration Initiative (Si2) panel discussion...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 28 2012
  • Don’t Blow Up Your Chip on the Tester!

    The photo at right shows a test socket and chip destroyed by thermal runaway. Can this really happen? Yes, it can and it sometimes does, if test power is significantly greater than functional power. To get a handle on this problem I talked to Bassilios Petrakis, product marketing director for Design...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Mar 26 2012
  • How Logic Synthesis is Changing

    You probably haven't read much about logic synthesis lately -- it's a mature technology that doesn't attract much attention. But that doesn't mean that new and exciting things aren't happening in synthesis and front-end design, as illustrated by presentations at a Synthesis Community...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Dec 14 2011
  • Three Die Stack -- A Big Step “Up” for 3D-ICs with TSVs

    A major advancement in 3D-IC through-silicon via (TSV) design will be unveiled Tuesday (Dec. 13) as representatives of CEA-LETI and ST-Ericsson describe the development of a three-die stack with wide I/O memory and logic. This tapeout is the result of a collaboration between these two organizations and...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Dec 13 2011
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