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DAC 2012 Panelists Tackle Tough Questions About 2.5D-ICs and 3D-ICs
In a sometimes contentious panel session at the Design Automation Conference (DAC 2012) June 7, experts discussed and debated key technology and business questions around 2.5D-ICs and 3D-ICs. One overall takeaway is that 2.5D technology is very close to volume production, but true 3D stacking raises...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Jun 14 2012
Cadence, ARM and TSMC Reveal 20nm Challenges and Solutions
At a recently archived EE Times webinar May 1, representatives of Cadence, ARM and TSMC noted three important points about the 20nm process node. Number one, its adoption is inevitable. Number two, the design and manufacturing challenges are significant. Number three, the challenges are manageable given...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, May 2 2012
CDNLive! – IBM Expert Quantifies Design Impact of Double Patterning
Double patterning will be an essential lithographic technique for ICs at 20nm and below. The more we can understand it, and quantify its impacts on the design flow, the easier it will be to adopt. A good step towards that understanding was taken at CDNLive! Silicon Valley 2012 (the recent Cadence user...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Sun, Apr 1 2012
ISQED Keynote: 20nm From a Custom/Analog Perspective
Most of the discussions about the upcoming 20nm process node have focused on digital design. Not so at the International Symposium on Quality of Electronic Design ( ISQED 2012 ) March 20, where Tom Beckley, senior vice president of R&D for Custom IC and Signoff in the Silicon Realization group at...
Posted to
Industry Insights
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by
rgoering
on Wed, Mar 21 2012
On-Line Presentation: 20nm Design Challenges, and a Look Ahead to 14nm
The Common Platform Technology Forum held March 14 in Santa Clara, California, provided an updated look at process technology, design challenges, and ecosystem collaboration at 28nm and below. Much of the content is available throughout 2012 as part of a Virtual Technology Forum . Following is a report...
Posted to
Industry Insights
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by
rgoering
on Mon, Mar 19 2012
TSMC CDNLive! Keynote – “We Can Beat Moore’s Law”
The world's largest foundry provider, TSMC, is confident it can keep up with the semiconductor scaling predicted by Moore's Law and can even outpace Moore's Law through 2.5D and 3D-ICs. It's all part of the "incredible high-tech future" predicted by Rick Cassidy, president of...
Posted to
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rgoering
on Wed, Mar 14 2012
Customer, Partner DFM Concerns Spur New Methodologies
Design for manufacturing (DFM) may not be as "hot" a topic as it was a few years ago - when there were many independent DFM companies - but foundries and chip design companies are in fact very concerned about DFM at 28nm and below. Some of those concerns have given rise to new technologies...
Posted to
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rgoering
on Tue, Feb 7 2012
SPIE Papers Showcase DFM and Lithography R&D
Ten Cadence papers planned for the upcoming SPIE Advanced Lithography conference, set for Feb. 12-16 in San Jose, California, demonstrate recent R&D developments in both "design side" design for manufacturing (DFM) and the computational lithography that takes place during the manufacturing...
Posted to
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(Weblog)
by
rgoering
on Thu, Jan 26 2012
ARM TechCon Paper: New Methodology Eases Challenges of 32/28nm Designs
The 32nm and 28nm process nodes, the most advanced nodes currently in production, pose formidable challenges in complexity, power management, variability, and manufacturability. A recent ARM TechCon paper authored by Cadence and Samsung described a methodology that can resolve those challenges. And it's...
Posted to
Industry Insights
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by
rgoering
on Wed, Nov 9 2011
Si2 Conference: New Directions for Low-Power Standards
The Silicon Integration Initiative (Si2) Conference Oct. 20 provided an ambitious new roadmap for low power standards. Presentations described the current Common Power Format (CPF) 2.0 release, steps towards interoperability with IEEE 1801 (Universal Power Format, UPF), a new approach to power modeling...
Posted to
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rgoering
on Mon, Oct 24 2011
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