Cadence.com will be under maintenance from Friday, Oct. 3rd at 6pm (PST) thru Sunday, Oct 5th at 11pm (PST).
Cadence.com login, registration, community posting and commenting functionalities will be disabled.
Home > Community > Tags > industry insights/3D/GSA
 
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more convenient.

Register | Membership benefits
Get email delivery of the Cadence blog (individual posts).
 

Email

* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Comments: *

industry insights,3D,GSA

  • Q&A: GSA Working Group Tackles Barriers to 3D-IC Adoption

    The Global Semiconductor Alliance ( GSA ) 3D IC Working Group is helping pave the way to mainstream adoption of 3D-ICs. With around 275 members, this group provides a neutral forum in which representatives of EDA vendors, design services houses, foundries, outsourced assembly and test (OSAT) providers...
    Posted to Industry Insights (Weblog) by rgoering on Mon, May 21 2012
  • Two New Resources for 3D-IC Design

    Just in time for the Design Automation Conference (DAC), two new publications are providing fresh perspectives about 3D-IC design. First, the Global Semiconductor Alliance ( GSA ) has released a "3D-IC Design Tools and Services Tour Guide" for next week's DAC. Secondly, a new Cadence technical...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 2 2011
Page 1 of 1 (2 items)