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Q&A: GSA Working Group Tackles Barriers to 3D-IC Adoption
The Global Semiconductor Alliance ( GSA ) 3D IC Working Group is helping pave the way to mainstream adoption of 3D-ICs. With around 275 members, this group provides a neutral forum in which representatives of EDA vendors, design services houses, foundries, outsourced assembly and test (OSAT) providers...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, May 21 2012
GSA Keynote: Analyst Has Good News, Bad News for Semiconductor Industry
Len Jelinek, director and chief analyst for semiconductor manufacturing at IHS iSuppli , would rather have given his Oct. 6 keynote speech at the Global Semiconductor Alliance ( GSA ) Semiconductor Ecosystem Summit six months earlier. At that time, he said, there were "great expectations" about...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Oct 10 2011
GTC Panel: CEOs Navigate a Changing IC Ecosystem
Semiconductor and system design have never been more promising -- or more challenging. How can IC design companies find their way to sucess? At the Global Technology Conference (GTC) Aug. 30, three CEOs and one vice president gave their perspectives on the rapidly changing IC design and manufacturing...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Sep 1 2011
Panel Video: Preventing IP Theft in a Global Market
How can semiconductor companies ensure IP integrity in a global marketplace? Are foundries liable if customers use stolen semiconductor IP? Do systems companies really care if their semiconductor IP is stolen? These are some of the questions that emerged at a Design Automation Conference panel in June...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Aug 4 2011
3D IC Ecosystem Panel: Different Views, Challenging Questions
The 3D IC supply chain ecosystem is just beginning to emerge, with roles that are currently unclear. So what happens when you bring together representatives from an outsourced assembly and test (OSAT) provider, memory maker, foundry, EDA vendor (Cadence), and a customer? The result: differing perspectives...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Sun, Apr 3 2011
DAC DFM Coalition - Do You Work On Sunday Afternoons?
It was a sunny, Sunday afternoon in Anaheim (across from Disneyland). That combination of weather and entertainment didn't sway a group of 35 engineers from participating in the DFMC (Design for Manufacturability Coalition) Workshop at DAC 2010. On the panel were: Luigi Capodieci - GLOBALFOUNDRIES...
Posted to
Manufacturability Signoff
(Weblog)
by
wilbur
on Wed, Jul 14 2010
Assura Foundry Support
I've been blogging a lot about Assura recently, so I thought I would continue by talking about rule decks. Inside Cadence, we maintain a database that shows which foundries support which process for which products. This means that we can quickly give you an answer if you are considering using a new...
Posted to
Manufacturability Signoff
(Weblog)
by
ChrisClee
on Mon, Mar 23 2009
The Buzz Around New Business Models
The buzz about showing and paying for value in EDA has been building over the past few years. People have complained about the high cost of tools and EDA vendors have complained about not getting enough value from the technology that can then be re-invested in the next generation tools. The same complaints...
Posted to
Manufacturability Signoff
(Weblog)
by
wilbur
on Fri, Mar 6 2009
Please allow me to ...
In the words of the Rolling Stones…. Please Allow Me to Introduce Myself ,,,,, I took a different slat than Chris on my intro but I am a Product Marketing Director for Cadence's Diagnostics and silicon analysis products. I also have over 20 years of EDA experience and began my career as a...
Posted to
Manufacturability Signoff
(Weblog)
by
Tom J
on Wed, Aug 6 2008
Anyone involved in managing OPC or DFM may want to read this
There is a good article in the August edition of Microlithography World that anyone involved in managing OPC or DFM may want to read. I may be a bit biased (I was one of the authors) but it is good...... Here's a link to the article . Fujitsu, Applied Materials and Cadence collaborated for this article...
Posted to
Manufacturability Signoff
(Weblog)
by
Tom J
on Wed, Aug 6 2008
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