Home > Community > Tags > encounter/28nm

	Login with a Cadence account.
Not a member yet? Create a permanent login account to make interactions with Cadence more conveniennt. Register \| Membership benefits

Get email delivery of the Cadence blog (individual posts).

Popular Tags

Browse All Tags

Email

* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Send yourself a copy

Cadence RSS Feeds

Intro copy of the newsletter section here, some intro copy of the newsletter. Instruction of how to subscribe to this newsletter.

Contact Us

Cadence Contacts

Global Office Locator
Find Offices worldwide »

Sales Inquiry
Request for Product information »
Cadence Channel Partners »

Corporate Headquarters
Cadence Design Systems, Inc.
2655 Seely Avenue
San Jose, CA 95134
Phone: 408.943.1234

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Comments: *

Send Yourself A Copy

encounter,28nm

Place and route on SOC encounter

Hello, I am a newbie at place and route operation. Can anyone please tell me how do you make sure that all the blockes i your design are arranged in a certain way while doing place and route . I mean I have like around 300 odd blockes to be eranged and I want them to be ordered row wise and column wise...

Posted to Digital Implementation (Forum) by amythpai on Sun, Mar 17 2013
Via Placement issue.

Hi every one, I'm Lakshmi Prashanth, and i'm new to this encounter tool, I've got a problem., initially when i was moving the PG net over the Macros, tool was automatically placing the via's, But suddenly yesterday, some via's are deleted automatically, I don't know how, and If...

Posted to Digital Implementation (Forum) by Leader on Tue, Feb 12 2013
TSMC Forum: An Update on 20nm, 3D-IC, and 16nm FinFETs

TSMC, the world's largest semiconductor foundry, is thinking big when it comes to next-generation process technology. At the TSMC Open Innovation Platform (OIP) Ecosystem Forum Oct. 16, TSMC described reference flows for 20nm and for multi-die integration, and revealed that ARM and TSMC are working...

Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 17 2012
Low-Power Design Case Studies: 15 CDNLive! Papers So Far This Year

CDNLive! is back with a bang in 2012, with very strong support from the Cadence user community worldwide. We're three-quarters the way through the events at the time of writing -- you can see the whole program on www.cadence.com at the CDNLive! 2012 Worldwide page. Proceedings are published so far...

Posted to Low Power (Weblog) by Pete Hardee on Mon, Sep 17 2012
ARM and Cadence Improve Cortex-A Power and Performance with Optimized Flow

For several years, ARM has offered processor optimization utilities (called POPs) that help users of ARM Cortex-A series processors optimize power, performance and area for a given process. This week (Aug. 9) ARM and Cadence took things one step further by announcing a POP that includes scripts that...

Posted to Industry Insights (Weblog) by rgoering on Thu, Aug 9 2012
When One Via Just Doesn’t Cut It – Recommended Settings for NanoRoute Including Multi-cut Via Insertion Flows

Maximizing the usage of Multi-cut vias by the router is one key to improving yield. And at advanced nodes it is essential step in the flow. So what are the proper settings and flow to use to maximize multi-cut via insertion with NanoRoute? And how do I know if I'm using the latest recommended settings...

Posted to Digital Implementation (Weblog) by wally1 on Thu, Apr 5 2012
Cadence-ARM Collaboration Brings Optimized Tools to SoC Designers

Cadence and ARM have been working closely together for several years, and that relationship reached a new milestone Oct. 18 with the joint announcement of the first 20nm tapeout using the Cortex-A15 MPCore processor. The announcement also brought news of a multi-year technology collaboration that will...

Posted to Industry Insights (Weblog) by rgoering on Tue, Oct 18 2011
“In Design” DFM Signoff – the Inside Story

As noted in a recent customer announcement with Fujitsu, Cadence offers "in design" design for manufacturability (DFM) signoff for digital, mixed-signal and custom IC design. The basic idea is simple - engineers run signoff DFM checks during the physical design process, instead of waiting until...

Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 5 2011
User View: Low Power Challenges at 40nm and Below

Low power design is hard enough at 65nm and above, and it poses additional challenges at 40nm and below, according to Alex Kuo, department manager at SoC design firm Global Unichip Corp. As noted in another Cadence Community blog post by Qi Wang, Kuo offered a presentation on low-power design at the...

Posted to Industry Insights (Weblog) by rgoering on Tue, Jun 21 2011
28 nm IC Design: The Devil Is In The Details

Smaller process technologies are enticing chip makers with bigger rewards from their end products. The shorter gate lengths at 28nm promise faster transistor speeds and less leakage power, and can double the amount of the logic that can be put into the same die area. Most importantly, however, more die...

Posted to Digital Implementation (Weblog) by Nora on Mon, Mar 14 2011

Page 1 of 2 (12 items) 1 2 Next >

Popular Tags

Email

Share

Subscribe

Contact Us

encounter,28nm

Place and route on SOC encounter

Via Placement issue.

TSMC Forum: An Update on 20nm, 3D-IC, and 16nm FinFETs

Low-Power Design Case Studies: 15 CDNLive! Papers So Far This Year

ARM and Cadence Improve Cortex-A Power and Performance with Optimized Flow

When One Via Just Doesn’t Cut It – Recommended Settings for NanoRoute Including Multi-cut Via Insertion Flows

Cadence-ARM Collaboration Brings Optimized Tools to SoC Designers

“In Design” DFM Signoff – the Inside Story

User View: Low Power Challenges at 40nm and Below

28 nm IC Design: The Devil Is In The Details