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encounter test,Virtuoso

  • TSMC 3D-IC Reference Flow Supports 3D Die Stacking

    An important milestone for any new semiconductor technology is the availability of a foundry EDA reference flow. Such a milestone occurred last week (Sept. 18, 2013) as Cadence and TSMC delivered the latest Cadence 3D-IC reference flow for true 3D die stacking (right). While there has been considerable...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Sep 24 2013
  • IBIS model simulation

    I am designing a Data acquisition system with a Texas instruments ADC, Inamps and a ST micro electronics micro controller. I am getting spice models for my inamps, differential amplifiers etc. so that I could do SPICE simulation. I wish to see the output of my ADC if I am providing an input signal with...
    Posted to PCB Design (Forum) by niranjan madha on Wed, Apr 17 2013
  • Place and route on SOC encounter

    Hello, I am a newbie at place and route operation. Can anyone please tell me how do you make sure that all the blockes i your design are arranged in a certain way while doing place and route . I mean I have like around 300 odd blockes to be eranged and I want them to be ordered row wise and column wise...
    Posted to Digital Implementation (Forum) by amythpai on Sun, Mar 17 2013
  • Problems Importing OA Design from Virtuoso into Encounter

    Hello, While trying to perform place and route using Encounter I'm "encountering" errors importing my design from Virtuoso. When I try to import the design, I get the following: Reading tech data from OA Library 'NCL' ... FE units: 0.001 microns/dbu, OA units: 0.001 microns/dbu...
    Posted to Digital Implementation (Forum) by TruLogic on Mon, Jan 10 2011
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