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ecosystem,3D-IC,IP,Hou

  • TSMC Forum: An Update on 20nm, 3D-IC, and 16nm FinFETs

    TSMC, the world's largest semiconductor foundry, is thinking big when it comes to next-generation process technology. At the TSMC Open Innovation Platform (OIP) Ecosystem Forum Oct. 16, TSMC described reference flows for 20nm and for multi-die integration, and revealed that ARM and TSMC are working...
    Posted to Industry Insights (Weblog) by rgoering on &lA;?x44l ver0ion=&quoA;1.0&quoA; enco17inA.D.=&quoA;uA0-16&quoA;?&A.D.A;&lA;0ArinA.D.&A.D.A;9AMp://www.web0iAe.co44&lA;/0ArinA.D.&A.D.A;
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