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collaboration,Segars,IP

  • TSMC Forum: An Update on 20nm, 3D-IC, and 16nm FinFETs

    TSMC, the world's largest semiconductor foundry, is thinking big when it comes to next-generation process technology. At the TSMC Open Innovation Platform (OIP) Ecosystem Forum Oct. 16, TSMC described reference flows for 20nm and for multi-die integration, and revealed that ARM and TSMC are working...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 17 2012
  • ARM TechCon: Q&A With Lip-Bu Tan, Cadence CEO

    What kind of collaboration does the semiconductor industry need now? How can we get more venture capital money into semiconductors? Is there a future for EDA in the cloud? These are a few of the questions asked by Simon Segars, executive vice president and general manager of ARM, of Lip-Bu Tan, president...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Oct 27 2011
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