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collaboration,Industry Insights,ecosystem

  • TSMC Forum: An Update on 20nm, 3D-IC, and 16nm FinFETs

    TSMC, the world's largest semiconductor foundry, is thinking big when it comes to next-generation process technology. At the TSMC Open Innovation Platform (OIP) Ecosystem Forum Oct. 16, TSMC described reference flows for 20nm and for multi-die integration, and revealed that ARM and TSMC are working...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 17 2012
  • Si2 DAC Panel: What Standards are Needed for 3D-ICs?

    3D-ICs with through-silicon vias (TSVs) are not yet in volume production, but work has already begun on design standards - and more work is needed soon. An excellent update on work in progress, and a discussion of what's needed, was provided at a Silicon Integration Initiative (Si2) panel discussion...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 28 2012
  • GTC Panel: CEOs Navigate a Changing IC Ecosystem

    Semiconductor and system design have never been more promising -- or more challenging. How can IC design companies find their way to sucess? At the Global Technology Conference (GTC) Aug. 30, three CEOs and one vice president gave their perspectives on the rapidly changing IC design and manufacturing...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Sep 1 2011
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