	Login with a Cadence account.
Not a member yet? Create a permanent login account to make interactions with Cadence more conveniennt. Register \| Membership benefits

Get email delivery of the Cadence blog (individual posts).

Popular Tags

Browse All Tags

Email

* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Send yourself a copy

Cadence RSS Feeds

Intro copy of the newsletter section here, some intro copy of the newsletter. Instruction of how to subscribe to this newsletter.

Contact Us

Cadence Contacts

Global Office Locator
Find Offices worldwide »

Sales Inquiry
Request for Product information »
Cadence Channel Partners »

Corporate Headquarters
Cadence Design Systems, Inc.
2655 Seely Avenue
San Jose, CA 95134
Phone: 408.943.1234

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Comments: *

Send Yourself A Copy

cloud,IP

Lip-Bu Tan at CDNLive 2013: Opportunities and Challenges for Electronics, and How Cadence Can Help

Lip-Bu Tan, Cadence president and CEO, is excited about ongoing innovation within the electronics industry - but he's also aware of challenges such as advanced node lithography, complexity, time-to-market, and rising design costs. In a keynote speech at the CDNLive Silicon Valley conference March...

Posted to Industry Insights (Weblog) by rgoering on Tue, Mar 12 2013
Who Needs 40/100 Gigabit Ethernet SoCs?

Short answer: the cloud. Thanks to cloud computing and cloud applications, data centers are having to manage large data transfers in very short periods of time. System-on-chip (SoC) solutions that support 40/100 Gbit Ethernet (GbE) are now in demand, and for this reason, Cadence today (Feb. 21, 2012...

Posted to Industry Insights (Weblog) by rgoering on Tue, Feb 21 2012
ARM TechCon: Q&A With Lip-Bu Tan, Cadence CEO

What kind of collaboration does the semiconductor industry need now? How can we get more venture capital money into semiconductors? Is there a future for EDA in the cloud? These are a few of the questions asked by Simon Segars, executive vice president and general manager of ARM, of Lip-Bu Tan, president...

Posted to Industry Insights (Weblog) by rgoering on Thu, Oct 27 2011
GTC Panel: CEOs Navigate a Changing IC Ecosystem

Semiconductor and system design have never been more promising -- or more challenging. How can IC design companies find their way to sucess? At the Global Technology Conference (GTC) Aug. 30, three CEOs and one vice president gave their perspectives on the rapidly changing IC design and manufacturing...

Posted to Industry Insights (Weblog) by rgoering on Thu, Sep 1 2011
Sonics Interview: AMBA Interconnect IP In The Cloud

Easier IP integration into systems-on-chip has been a long-sought goal, and is a key part of the EDA360 vision . In a Design Automation Conference interview, I learned how Sonics and Cadence are working together to provide an integration-optimized solution for AMBA interconnect IP. Sonics , a provider...

Posted to Industry Insights (Weblog) by rgoering on Thu, Aug 19 2010
Presentation: Rethinking Software-as-a-Service For EDA

One of the more startling statements at the recent Electronic Design Processes (EDP) workshop came in a presentation from James Colgan, CEO of Xuropa . At one point he appeared to be saying that software-as-a-service ( SaaS ) is not the right model for EDA, at least not for quite some time. But Xuropa...

Posted to Industry Insights (Weblog) by rgoering on Wed, Apr 21 2010

Page 1 of 1 (6 items)

Popular Tags

Email

Share

Subscribe

Contact Us

cloud,IP

Lip-Bu Tan at CDNLive 2013: Opportunities and Challenges for Electronics, and How Cadence Can Help

Who Needs 40/100 Gigabit Ethernet SoCs?

ARM TechCon: Q&A With Lip-Bu Tan, Cadence CEO

GTC Panel: CEOs Navigate a Changing IC Ecosystem

Sonics Interview: AMBA Interconnect IP In The Cloud

Presentation: Rethinking Software-as-a-Service For EDA