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TSVs,Si2

  • Si2 DAC Panel: What Standards are Needed for 3D-ICs?

    3D-ICs with through-silicon vias (TSVs) are not yet in volume production, but work has already begun on design standards - and more work is needed soon. An excellent update on work in progress, and a discussion of what's needed, was provided at a Silicon Integration Initiative (Si2) panel discussion...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 28 2012
  • 3D IC Standards – First, Let’s Define Our Terms

    There's a lot of interest in 3D ICs these days, but there are many challenges to solve before 3D IC design can move into the mainstream. One challenge is the establishment of standards for design, modeling, and manufacturability. But the starting point is likely to be something even simpler - a dictionary...
    Posted to Industry Insights (Weblog) by rgoering on Mon, May 10 2010
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