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TSVs,Qualcomm

  • Si2 DAC Panel: What Standards are Needed for 3D-ICs?

    3D-ICs with through-silicon vias (TSVs) are not yet in volume production, but work has already begun on design standards - and more work is needed soon. An excellent update on work in progress, and a discussion of what's needed, was provided at a Silicon Integration Initiative (Si2) panel discussion...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 28 2012
  • A Qualcomm Perspective on 3D ICs

    3D integration is a promising new technology that can potentially save space and power by stacking die in 3 dimensions. I recently spoke with Riko Radojcic, Qualcomm design lead for TSS (Through Silicon Stacking – Qualcomm’s term for 3D ICs), about how Qualcomm is deploying this technology...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Apr 20 2009
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