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TSVs,DATE

  • A Qualcomm Perspective on 3D ICs

    3D integration is a promising new technology that can potentially save space and power by stacking die in 3 dimensions. I recently spoke with Riko Radojcic, Qualcomm design lead for TSS (Through Silicon Stacking – Qualcomm’s term for 3D ICs), about how Qualcomm is deploying this technology...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Apr 20 2009
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