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TSV,Encounter Test,test,Industry Insights

  • How Imec and Cadence “Wrapped Up” 3D-IC Test

    One of the most challenging aspects of 3D-IC development involves the testing of vertical die stacks with through-silicon vias (TSVs). You have to propagate test data up and down through the stack, verify the functioning of TSVs that are too small to probe, and isolate the individual dies you want to...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Aug 1 2011
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