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TSV,Encounter Test,test,Encounter

  • Place and route on SOC encounter

    Hello, I am a newbie at place and route operation. Can anyone please tell me how do you make sure that all the blockes i your design are arranged in a certain way while doing place and route . I mean I have like around 300 odd blockes to be eranged and I want them to be ordered row wise and column wise...
    Posted to Digital Implementation (Forum) by amythpai on Sun, Mar 17 2013
  • How Imec and Cadence “Wrapped Up” 3D-IC Test

    One of the most challenging aspects of 3D-IC development involves the testing of vertical die stacks with through-silicon vias (TSVs). You have to propagate test data up and down through the stack, verify the functioning of TSVs that are too small to probe, and isolate the individual dies you want to...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Aug 1 2011
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