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TSV,Encounter Test,3D IC

  • TSMC 3D-IC Reference Flow Supports 3D Die Stacking

    An important milestone for any new semiconductor technology is the availability of a foundry EDA reference flow. Such a milestone occurred last week (Sept. 18, 2013) as Cadence and TSMC delivered the latest Cadence 3D-IC reference flow for true 3D die stacking (right). While there has been considerable...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Sep 24 2013
  • How Imec and Cadence “Wrapped Up” 3D-IC Test

    One of the most challenging aspects of 3D-IC development involves the testing of vertical die stacks with through-silicon vias (TSVs). You have to propagate test data up and down through the stack, verify the functioning of TSVs that are too small to probe, and isolate the individual dies you want to...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Aug 1 2011
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