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  • A New Information Resource for 3D-IC TSV Design

    A new solutions page on Cadence.com provides a great deal of information about 3D-ICs with through-silicon vias (TSVs). In addition to a description of the Cadence 3D-IC design, test, and semiconductor IP solutions, it includes press releases, blog posts, whitepapers, articles, and an archived webinar...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Oct 16 2012
  • DAC 2012 Panelists: How to Succeed at 28nm, 20nm and 14nm

    What will it take to achieve silicon success at 28nm and below? That was the question put to a panel of experts at a Cadence-sponsored breakfast at the Design Automation Conference ( DAC 2012 ) June 6, where speakers from IBM, Cadence, ARM, Samsung, and GLOBALFOUNDRIES shed new light on business and...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Jun 12 2012
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