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TSV,3D-IC,boundary scan

  • An Update on the JEDEC Wide I/O Standard for 3D-ICs

    One of the big advantages of 3D-ICs with through-silicon vias (TSVs) is the potential for much faster memory bandwidth compared to conventional 2D ICs. That's why the emerging JEDEC wide I/O mobile DRAM memory standard, which takes full advantage of 3D die stacking to provide significant power and...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Dec 15 2011
  • How Imec and Cadence “Wrapped Up” 3D-IC Test

    One of the most challenging aspects of 3D-IC development involves the testing of vertical die stacks with through-silicon vias (TSVs). You have to propagate test data up and down through the stack, verify the functioning of TSVs that are too small to probe, and isolate the individual dies you want to...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Aug 1 2011
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