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Standards

Q&A: GSA Working Group Tackles Barriers to 3D-IC Adoption

The Global Semiconductor Alliance ( GSA ) 3D IC Working Group is helping pave the way to mainstream adoption of 3D-ICs. With around 275 members, this group provides a neutral forum in which representatives of EDA vendors, design services houses, foundries, outsourced assembly and test (OSAT) providers...

Posted to Industry Insights (Weblog) by rgoering on Mon, May 21 2012
Panelists: What Needs to Happen for 3D-IC TSV Success

It's time to get to work if we want to bring 3D-ICs with through-silicon vias (TSVs) into the semiconductor design mainstream. What ecosystem support is needed in the short term, medium term, and long term to make this new technology successful? That's the question that was put to a panel of...

Posted to Industry Insights (Weblog) by rgoering on Wed, Apr 11 2012
EDA Symposium: Users Cite 3D-IC Design Tool Needs

What's needed to bring 3D-ICs with through-silicon vias (TSVs) - or 2.5D ICs with silicon interposers - into the IC design mainstream and volume production? That question resonated through a day-long session on 3D-ICs at the Electronic Design Processes Symposium ( EDPS ) April 6, 2012 in Monterey...

Posted to Industry Insights (Weblog) by rgoering on Mon, Apr 9 2012
2011 EDA Standards Update and 2012 Forecast

As system complexity grows and semiconductor process nodes shrink, EDA industry standards are more important than ever. With today's time-to-market pressures, the last thing you'd want to do is waste time due to incompatible formats, tools or methodologies. Fortunately, 2011 was a productive...

Posted to Industry Insights (Weblog) by rgoering on Wed, Dec 21 2011
Equine Anatomy, Pax Romana and the Reach of Standards

At the recent Synopsys EDA Interoperability Forum, the opening session focused on a 10 year review of standards and interoperability between EDA tools. Three speakers -- Philippe Magarshack (Central R&D Group VP, STMicroelectronics), John Goodenough (Vice-President of Design Technology and Automation...

Posted to System Design and Verification (Weblog) by fschirrmeister on Wed, Dec 14 2011
Accellera-OSCI Union Completed – What It Means for EDA Standards

Two prominent EDA industry standards organizations -- Accellera and the Open SystemC Initiative ( OSCI ) - announced today (Dec. 5) the completion of their merger under the name "Accellera Systems Initiative." The stage is now set for a unified EDA standards effort that cuts across multiple...

Posted to Industry Insights (Weblog) by rgoering on Mon, Dec 5 2011
Verification and the Need for Collaboration

Earlier this week I was at the ARM TechCon in Santa Clara, a show that gets better and busier every year. I was walking around the expo floor, checking out the new vendors and saying hello to old friends, when I got into a conversation with one of our more active partners. He thanked me for supporting...

Posted to Functional Verification (Weblog) by tomacadence on Fri, Oct 28 2011
Si2 Conference: New Directions for Low-Power Standards

The Silicon Integration Initiative (Si2) Conference Oct. 20 provided an ambitious new roadmap for low power standards. Presentations described the current Common Power Format (CPF) 2.0 release, steps towards interoperability with IEEE 1801 (Universal Power Format, UPF), a new approach to power modeling...

Posted to Industry Insights (Weblog) by rgoering on Mon, Oct 24 2011
Si2’s Steve Schulz: “Setting the Standards for EDA360”

EDA360 represents a significant change in which the EDA industry plays a broader role in the creation of hardware/software systems ready for applications deployment. A shift this profound must be rooted in industry standards, according to Steve Schulz, president of the Silicon Integration Initiative...

Posted to Industry Insights (Weblog) by rgoering on Mon, Jun 27 2011
Accellera – OSCI Union: New Synergy for EDA Standards?

Two leading EDA industry standards organizations - Accellera and the Open SystemC Initiative ( OSCI ) - announced their intent to merge into a "new organization" today (June 22, 2011). The move will bring most "front end" EDA standards (RTL and above) under one roof, and potentially...

Posted to Industry Insights (Weblog) by rgoering on Wed, Jun 22 2011

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Standards

Q&A: GSA Working Group Tackles Barriers to 3D-IC Adoption

Panelists: What Needs to Happen for 3D-IC TSV Success

EDA Symposium: Users Cite 3D-IC Design Tool Needs

2011 EDA Standards Update and 2012 Forecast

Equine Anatomy, Pax Romana and the Reach of Standards

Accellera-OSCI Union Completed – What It Means for EDA Standards

Verification and the Need for Collaboration

Si2 Conference: New Directions for Low-Power Standards

Si2’s Steve Schulz: “Setting the Standards for EDA360”

Accellera – OSCI Union: New Synergy for EDA Standards?