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SoC,digital implementation
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CDNLive High-Performance Track: Do You Have What it Takes to Get Your High-Performance SoC to Market?
Implementing SoCs with embedded processors at advanced nodes has become increasingly difficult. This is due to the complexity of the design functionality as well as the low power and increased performance requirements driven by a plethora of end-user applications in modern hand-held devices. Path-breaking...
Posted to
Digital Implementation
(Weblog)
by
Vasu Madabushi
on Sun, Mar 10 2013
CDNLive! 2012 Proceedings – Over 150 User Presentations on Design and Verification
A fantastic resource is available for chip and system designers -- proceedings from five of the CDNLive! Conferences held in 2012. By my count this includes over 150 user-authored presentations given at CDNLive! Silicon Valley (March 12-13), CDNLive! EMEA (May 6-8), CDNLive! Taiwan (July 11), CDNLive...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Jan 9 2013
Mixed Signal: Why The Sudden Attention?
With DAC 2010 rapidly approaching, we can again expect that lots of EDA and IP vendors will use “mixed signal” somewhere in their company’s messaging. Last year it seemed that nearly everyone wanted to jump on the mixed signal “bandwagon” … so what caused this sudden jump in interest in mixed signal...
Posted to
Digital Implementation
(Weblog)
by
PeteMc
on Mon, May 24 2010
Q&A: New Challenges, New Solutions In IC Implementation
Advanced nodes are raising tough new challenges for analog/mixed-signal and digital IC implementation, according to David Desharnais, group director and product manager for implementation at Cadence. In this interview, he notes where IC designers are struggling and succeeding, and describes Cadence's...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Mar 8 2010
Should IC Designers Worry About Temperature?
Three years ago I wrote an EE Times article about the growing importance of thermal gradients and thermal analysis at 90 nm and below. That article turned out to be ahead of its time. Today, thermal issues are not among the top few designer concerns at mainstream process nodes. But indications are that...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Jan 21 2010
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