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Silicon Integration Initiative,Qualcomm

  • Si2 DAC Panel: What Standards are Needed for 3D-ICs?

    3D-ICs with through-silicon vias (TSVs) are not yet in volume production, but work has already begun on design standards - and more work is needed soon. An excellent update on work in progress, and a discussion of what's needed, was provided at a Silicon Integration Initiative (Si2) panel discussion...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 28 2012
  • An Expert’s View on Power Formats and Methodology

    In the last five years since the introduction of power formats, using a side file to describe power intent such as power domains, power modes and associated interface logic has become the mainstream low power design methodology. This marks great progress toward automating complex low power design techniques...
    Posted to Low Power (Weblog) by Pete Hardee on Wed, Aug 24 2011
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