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Silicon Diagnostics

  • Getting Good Silicon With More Accurate Timing
    In these difficult economic times, achieving silicon success (functional and meeting specs) within an iteration becomes an even higher priority than before; there might not be a second chance to win that socket or hit that sales window. To that end, there appears to be a heightened interest in variation...
    Posted to Manufacturability Signoff (Weblog) by wilbur on Fri, Jan 9 2009

  • Diagnosis of Compressed Test Patterns: Several Things to Consider
    Today, it is essential to put into place a strong methodology to identify sources of yield loss during manufacturing. One widely accepted method involves diagnosing a representative sample of device failures during manufacturing test. The failing results are aggregated, analyzed and a Pareto is created...
    Posted to Manufacturability Signoff (Weblog) by Tom J on Tue, Oct 21 2008

  • What works best?
    Today's conventional wisdom tells us EDA folks the majority of yield loss at semiconductor companies is due to systematic issues, that's what my customers say to me. When I speak with new prospective users of my yield ramp solution, I normally see concurring facial expressions when I mention...
    Posted to Manufacturability Signoff (Weblog) by Tom J on Thu, Aug 14 2008

  • Please allow me to ...
    In the words of the Rolling Stones…. Please Allow Me to Introduce Myself ,,,,, I took a different slat than Chris on my intro but I am a Product Marketing Director for Cadence's Diagnostics and silicon analysis products. I also have over 20 years of EDA experience and began my career as a...
    Posted to Manufacturability Signoff (Weblog) by Tom J on Wed, Aug 6 2008

  • Anyone involved in managing OPC or DFM may want to read this
    There is a good article in the August edition of Microlithography World that anyone involved in managing OPC or DFM may want to read. I may be a bit biased (I was one of the authors) but it is good...... Here's a link to the article . Fujitsu, Applied Materials and Cadence collaborated for this article...
    Posted to Manufacturability Signoff (Weblog) by Tom J on Wed, Aug 6 2008
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