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Si2

Q&A: Qi Wang Updates EDA Power Intent Format Standards

IC design teams can use one of two formats to express power intent - the Common Power Format (CPF) from the Silicon Integration Initiative ( Si2 ), or IEEE 1801 , also known as the Unified Power Format (UPF). Efforts are now underway to bring the two formats closer together, and Qi Wang, technical marketing...

Posted to Industry Insights (Weblog) by rgoering on Wed, Mar 20 2013
Video: What the Newly Approved IEEE 1801-2013 Low Power Format (UPF 2.1) Includes

The IEEE RevCom (Review Committee) approved a new version of the IEEE 1801 low power format, also known as the Unified Power Format (UPF), March 5. The new version is IEEE 1801-2013 or UPF 2.1. It's a significant step towards "methodology convergence" with the Common Power Format (CPF)...

Posted to Industry Insights (Weblog) by rgoering on Wed, Mar 6 2013
Si2 Talk: Why System-Level Low Power is Challenging

There's a lot of interest in "system level" low power design -- but what does it really mean? "There a lot of confusion," said Pete Hardee, director of solutions marketing at Cadence, in a presentation at the recent Silicon Integration Initiative ( Si2 ) Conference. "What's...

Posted to Industry Insights (Weblog) by rgoering on Mon, Oct 15 2012
Si2: Jim Hogan Predicts “Custom 2.0” IC Design Retooling

A re we heading for a major retooling in custom IC design? EDA veteran Jim Hogan thinks so, and in a keynote speech at the Silicon Integration Initiative ( Si2 ) Conference Oct. 9, 2012, he argued that the consumer electronics marketplace will drive a new era he calls "Custom 2.0." The Si2...

Posted to Industry Insights (Weblog) by rgoering on Thu, Oct 11 2012
Si2 DAC Panel: What Standards are Needed for 3D-ICs?

3D-ICs with through-silicon vias (TSVs) are not yet in volume production, but work has already begun on design standards - and more work is needed soon. An excellent update on work in progress, and a discussion of what's needed, was provided at a Silicon Integration Initiative (Si2) panel discussion...

Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 28 2012
DAC 2012: EDA Industry Celebrates 10 Years of OpenAccess

The OpenAccess standard, which includes a common data model, API and reference database, has been one of the most successful and impactful standards in EDA history. Those who imagined, created, and continue to maintain and improve OpenAccess got some long overdue recognition June 4 at a Silicon Integration...

Posted to Industry Insights (Weblog) by rgoering on Mon, Jun 4 2012
Q&A: GSA Working Group Tackles Barriers to 3D-IC Adoption

The Global Semiconductor Alliance ( GSA ) 3D IC Working Group is helping pave the way to mainstream adoption of 3D-ICs. With around 275 members, this group provides a neutral forum in which representatives of EDA vendors, design services houses, foundries, outsourced assembly and test (OSAT) providers...

Posted to Industry Insights (Weblog) by rgoering on Mon, May 21 2012
See Cadence at DAC 2012 – Panels, Tutorials, “I Love DAC,” and the Denali Party

It's that time of the year again! The 49 th Design Automation Conference ( DAC 2012 ) is just a little over one month away, and Cadence will have an active presence on the exhibit floor, on panel discussions, in tutorials and workshops, in the user track, and in a co-located event that includes a...

Posted to Industry Insights (Weblog) by rgoering on Wed, Apr 25 2012
EDA Symposium: Users Cite 3D-IC Design Tool Needs

What's needed to bring 3D-ICs with through-silicon vias (TSVs) - or 2.5D ICs with silicon interposers - into the IC design mainstream and volume production? That question resonated through a day-long session on 3D-ICs at the Electronic Design Processes Symposium ( EDPS ) April 6, 2012 in Monterey...

Posted to Industry Insights (Weblog) by rgoering on Mon, Apr 9 2012
Q&A: OpenAccess 10th Anniversary -- A Look Backwards and Forwards

OpenAccess is one of the most successful and impactful standards in the history of the EDA industry. By providing a C++ API, data model, and reference database implementation, OpenAccess has brought unprecedented levels of integration to analog and digital IC implementation. This year OpenAccess is celebrating...

Posted to Industry Insights (Weblog) by rgoering on Tue, Mar 20 2012

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Si2

Q&A: Qi Wang Updates EDA Power Intent Format Standards

Video: What the Newly Approved IEEE 1801-2013 Low Power Format (UPF 2.1) Includes

Si2 Talk: Why System-Level Low Power is Challenging

Si2: Jim Hogan Predicts “Custom 2.0” IC Design Retooling

Si2 DAC Panel: What Standards are Needed for 3D-ICs?

DAC 2012: EDA Industry Celebrates 10 Years of OpenAccess

Q&A: GSA Working Group Tackles Barriers to 3D-IC Adoption

See Cadence at DAC 2012 – Panels, Tutorials, “I Love DAC,” and the Denali Party

EDA Symposium: Users Cite 3D-IC Design Tool Needs

Q&A: OpenAccess 10th Anniversary -- A Look Backwards and Forwards