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Samsung,3D IC,Design Automation Conference,DAC

  • DAC Panel: 20nm is Tough, But Not a Roadblock

    So far the move to lower semiconductor process nodes has continued unabated, but the upcoming 20nm node is causing a lot of concern. Lithography is so challenging that extra masks ( double patterning ) will be required. Will designs be technically and economically feasible? Panelists at the Design Automation...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Jun 6 2011
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