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SPICE,design rules

  • ARM TechCon: Inside Story of a 14nm FinFET Tapeout

    The next frontier in semiconductor design is the 14nm process node, and it will come with a new type of transistor, the FinFET. 14nm FinFET technology moved closer to reality at the ARM TechCon conference Oct. 30, 2012, where a Cadence sponsored technical session announced a 14nm test chip tapeout using...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 31 2012
  • User View: A 20nm Custom IC Constraint-Driven Flow

    If the semiconductor industry is going to ramp up for 20nm design, a custom IC flow that can handle this process node is essential. This flow will require more automation than previous nodes. In a recorded audio presentation at the Cadence web site Francois Lemery, member of the Technology R&D group...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Jul 25 2012
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