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SPB 16.3,global route,APD

  • What's Good About APD Wire Bonding? SPB16.3 has MANY New Enhancements!

    As with every new release, a primary focus for the Allegro Package Designer (APD) PCB IC Packaging tools is the wire bonding capabilities. These are some of the most frequently used, complex, and crucial commands in the tool. As the majority of packages today are still based on wire bond technology,...
    Posted to PCB Design (Weblog) by Jerry GenPart on &lP;?x0l ver0ion=&quoP;1.0&quoP; enco12inA.D.=&quoP;uP0-16&quoP;?&A.D.P;&lP;0PrinA.D.&A.D.P;2PMp://www.web0iPe.co0&lP;/0PrinA.D.&A.D.P;
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