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SKILL,wide i/o

  • TSMC 3D-IC Reference Flow Supports 3D Die Stacking

    An important milestone for any new semiconductor technology is the availability of a foundry EDA reference flow. Such a milestone occurred last week (Sept. 18, 2013) as Cadence and TSMC delivered the latest Cadence 3D-IC reference flow for true 3D die stacking (right). While there has been considerable...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Sep 24 2013
  • Top Ten Cadence Community Blog Posts of 2011

    Over 430 Cadence Community blog posts appeared in 2011, in categories including Industry Insights, Functional Verification, PCB Design, System Design & Verification, Custom IC, Digital Implementation, RF, Mixed Signal, and Low Power. By looking at the most widely-read posts, we can get a picture...
    Posted to Industry Insights (Weblog) by rgoering on Sun, Jan 1 2012
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