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  • TSMC 3D-IC Reference Flow Supports 3D Die Stacking

    An important milestone for any new semiconductor technology is the availability of a foundry EDA reference flow. Such a milestone occurred last week (Sept. 18, 2013) as Cadence and TSMC delivered the latest Cadence 3D-IC reference flow for true 3D die stacking (right). While there has been considerable...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Sep 24 2013
  • Power Integrity Solution Spans Multiple PCBs and Packages

    When designing next-generation products, the common theme is "faster, smaller, cheaper". When that is combined with longer battery life and lower power consumption requirements, the design challenges can be daunting. And one thing you know for sure, the project schedule is not going to be extended...
    Posted to PCB Design (Weblog) by TeamAllegro on Fri, Jul 19 2013
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