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Power,Design Automation Conference

  • DAC 2013: Qualcomm, TI Keynoters Present Mobile SoC Design Challenges and Solutions

    Keynote speeches at electronic design conferences tend to focus on high-level industry issues. The "Designer Keynote," part of the Designer Track at the recent Design Automation Conference ( DAC 2013 ), was different. In engineer-to-engineer talks, design managers from Qualcomm and Texas Instruments...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Jun 11 2013
  • Si2 DAC Panel: What Standards are Needed for 3D-ICs?

    3D-ICs with through-silicon vias (TSVs) are not yet in volume production, but work has already begun on design standards - and more work is needed soon. An excellent update on work in progress, and a discussion of what's needed, was provided at a Silicon Integration Initiative (Si2) panel discussion...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jun 28 2012
  • What’s Hot for Mixed-Signal At DAC?

    Analog/mixed-signal design is a hot topic at the Design Automation Conference! At DAC 2012 at San Francisco's Moscone Center next week (June 4-7), you can keep up with the latest developments in mixed-signal design methodology, including design, implementation and verification. You will find it is...
    Posted to Mixed-Signal Design (Weblog) by QiWang on Thu, May 31 2012
  • What’s Cool for Low-Power at DAC?

    Low-power design promises to be a key theme of the Design Automation Conference once again! At DAC 2012 at San Francisco's Moscone Center next week (June 4-7), if you need to cover design, implementation and verification of this important subject, there's a lot to choose from at Cadence's...
    Posted to Low Power (Weblog) by Pete Hardee on Wed, May 30 2012
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