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Panel,EDA
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Panelists: What Needs to Happen for 3D-IC TSV Success
It's time to get to work if we want to bring 3D-ICs with through-silicon vias (TSVs) into the semiconductor design mainstream. What ecosystem support is needed in the short term, medium term, and long term to make this new technology successful? That's the question that was put to a panel of...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Apr 11 2012
DVCon Panel: Will Differentiation Through Software Kill Chip Design?
Will systems-on-chip (SoCs) become so expensive to design that people are going to buy chips off the shelf, and differentiate products through software alone? That's one question that was put before a panel of EDA industry experts at the DVCon conference Feb. 29, 2012. Short answer -- no, but we...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Mar 1 2012
DAC Report: Ten Takeaways From The EDA CEO Panel
In what is sure to be a highlight from this year’s Design Automation Conference , CEOs of the three largest EDA companies gathered Monday, July 27 to talk about the present and future of the EDA industry. Lip-Bu Tan (Cadence), Wally Rhines (Mentor Graphics), and Aart de Geus (Synopsys) were realistic...
Posted to
Industry Insights
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by
rgoering
on Tue, Jul 28 2009
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