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PCB design,layout,APD
"PCB design"
ADRC
advanced package designer
ADW
Allegro
Allegro 16.3
Allegro 16.5
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Constraint-driven PCB Design flow
DEHDL
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What's Good About APD’s Die Abstract Libraries? You’ll Need the 16.5 Release to See!
In System in Package (SiP) 16.3, the co-design die flow introduced the distributed co-design flow concept, where there is no direct interaction with I/O Planner. Die information flowing between Encounter and SiP Layout is done via a die abstract. In flows up through 16.3, you first need to load the LEF...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Jan 24 2012
What's Good About APD’s Die Abstract Compare? You’ll Need the 16.5 Release to See!
In the distributed co-design environment in the SPB16.5 Allegro Package Designer release, a die abstract file is used to convey die information between IC and package layout tools. For ECO purposes, it is imperative to know the changes that are incorporated inside an abstract file before incorporating...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Oct 18 2011
What's Good About Retaining Electrical Constraints? Look to SPB16.5 and See!
Currently, many of the SPB products support extended nets, better known as Xnets. Xnets are created automatically when a signal model is assigned to a component and that signal model defines that a connection is to be made between two pins of the component. This creates an Xnet that connects the nets...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Mon, Aug 8 2011
What's Good About APD’s Assembly DRCs? You’ll Need the 16.5 Release to See!
Prior to the Allegro Package Designer (APD) 16.3 release, Design Rule Check (DRC) markers created by Assembly Rule Checks had to be external DRC markers since no constraint IDs were associated with the ADRC constraints. In the 16.3 release, Constraint IDs were created for each of the rules. It enabled...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Jul 26 2011
What's Good About Cadence Online Support Product Pages? – Check Out This List!
I wrote about the new Cadence Online Support features in one of my blog posts last year. One of our Silicon Package Board (SPB) Customer Support AEs suggested that I include the Cadence Online Support Product Page URL whenever I write about a specific product’s feature. I will be doing that --...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Wed, Mar 2 2011
What's Good About APD Wire Bonding? SPB16.3 has MANY New Enhancements!
As with every new release, a primary focus for the Allegro Package Designer (APD) PCB IC Packaging tools is the wire bonding capabilities. These are some of the most frequently used, complex, and crucial commands in the tool. As the majority of packages today are still based on wire bond technology,...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Wed, Jan 12 2011
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