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LDE,DFM,Double Patterning

  • Cadence, ARM and TSMC Reveal 20nm Challenges and Solutions

    At a recently archived EE Times webinar May 1, representatives of Cadence, ARM and TSMC noted three important points about the 20nm process node. Number one, its adoption is inevitable. Number two, the design and manufacturing challenges are significant. Number three, the challenges are manageable given...
    Posted to Industry Insights (Weblog) by rgoering on Wed, May 2 2012
  • ISQED Keynote: 20nm From a Custom/Analog Perspective

    Most of the discussions about the upcoming 20nm process node have focused on digital design. Not so at the International Symposium on Quality of Electronic Design ( ISQED 2012 ) March 20, where Tom Beckley, senior vice president of R&D for Custom IC and Signoff in the Silicon Realization group at...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Mar 21 2012
  • SPIE Papers Showcase DFM and Lithography R&D

    Ten Cadence papers planned for the upcoming SPIE Advanced Lithography conference, set for Feb. 12-16 in San Jose, California, demonstrate recent R&D developments in both "design side" design for manufacturing (DFM) and the computational lithography that takes place during the manufacturing...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jan 26 2012
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