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Industry Insights,low power,3D IC

Q&A: Jiayuan Fang Discusses Sigrity, Cadence Merger, Signal and Power Integrity, and 3D-ICs

In July 2012 Cadence announced its acquisition of Sigrity , a leading provider of signal integrity (SI) and power integrity (PI) analysis tools for chip, package and board. Jiayuan Fang, Sigrity founder and CEO, joined Cadence as vice-president of R&D for high-speed design products in the Silicon...

Posted to Industry Insights (Weblog) by rgoering on Wed, Dec 12 2012
DAC 2012 Panelists: How to Succeed at 28nm, 20nm and 14nm

What will it take to achieve silicon success at 28nm and below? That was the question put to a panel of experts at a Cadence-sponsored breakfast at the Design Automation Conference ( DAC 2012 ) June 6, where speakers from IBM, Cadence, ARM, Samsung, and GLOBALFOUNDRIES shed new light on business and...

Posted to Industry Insights (Weblog) by rgoering on Tue, Jun 12 2012
12 Hot EDA Topics – 78 DAC Demo Sessions

Whatever your role in the chip or system design process, there is probably a Cadence demo geared to your interests at the Design Automation Conference ( DAC 2012 ) June 3-7 in San Francisco. Cadence has three demo suites at its booth (#1930) and is running one-hour demos from 10:00 am to 5:00 pm Monday...

Posted to Industry Insights (Weblog) by rgoering on Thu, May 24 2012
GTC Panel: Getting Best Use From Older IC Process Nodes

Time for a mainstream revolution? That was the title of a lively panel discussion at the Global Technology Conference ( GTC ) Aug. 30. Panelists noted that there's still a lot of activity at 65nm and above. They discussed why this is true, whether mature nodes can be retrofitted with new capabilities...

Posted to Industry Insights (Weblog) by rgoering on Mon, Sep 5 2011
Si2’s Steve Schulz: “Setting the Standards for EDA360”

EDA360 represents a significant change in which the EDA industry plays a broader role in the creation of hardware/software systems ready for applications deployment. A shift this profound must be rooted in industry standards, according to Steve Schulz, president of the Silicon Integration Initiative...

Posted to Industry Insights (Weblog) by rgoering on Mon, Jun 27 2011

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Industry Insights,low power,3D IC

Q&A: Jiayuan Fang Discusses Sigrity, Cadence Merger, Signal and Power Integrity, and 3D-ICs

DAC 2012 Panelists: How to Succeed at 28nm, 20nm and 14nm

12 Hot EDA Topics – 78 DAC Demo Sessions

GTC Panel: Getting Best Use From Older IC Process Nodes

Si2’s Steve Schulz: “Setting the Standards for EDA360”