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Industry Insights,Virtuoso,QRC

  • TSMC 3D-IC Reference Flow Supports 3D Die Stacking

    An important milestone for any new semiconductor technology is the availability of a foundry EDA reference flow. Such a milestone occurred last week (Sept. 18, 2013) as Cadence and TSMC delivered the latest Cadence 3D-IC reference flow for true 3D die stacking (right). While there has been considerable...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Sep 24 2013
  • How Cadence Helps Universities Build EDA Infrastructures

    Many EDA companies, including Cadence, have university programs that make it easier for academia to acquire tools. But what about the software/hardware infrastructure that supports those tools? In this era of budget shortfalls, university compute infrastructures are under severe stress. Recently the...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Nov 7 2012
  • ARM TechCon: Inside Story of a 14nm FinFET Tapeout

    The next frontier in semiconductor design is the 14nm process node, and it will come with a new type of transistor, the FinFET. 14nm FinFET technology moved closer to reality at the ARM TechCon conference Oct. 30, 2012, where a Cadence sponsored technical session announced a 14nm test chip tapeout using...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 31 2012
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