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Industry Insights,Cadence,Panel
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Panelists: Low Power Design Needs System-Level Boost
When low-power design experts get together, much of the conversation turns to the system level. At least that was the case at the recent Low Power Technology Summit held at Cadence Oct. 18, 2012, where audience members questioned panelists about early power estimation, power modeling, and the role of...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Sun, Oct 28 2012
Panel: Signal Integrity Solutions for High Data Rate Interfaces
Serial link and DDR memory interfaces are well into Gbits/second territory, making it possible to design a new generation of high-performance devices. But these new interfaces can also greatly increase signal integrity challenges. At an August 28 EDN-hosted webinar panel , experts provided a wealth of...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Tue, Sep 4 2012
Si2 DAC Panel: What Standards are Needed for 3D-ICs?
3D-ICs with through-silicon vias (TSVs) are not yet in volume production, but work has already begun on design standards - and more work is needed soon. An excellent update on work in progress, and a discussion of what's needed, was provided at a Silicon Integration Initiative (Si2) panel discussion...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Jun 28 2012
Panelists: What Needs to Happen for 3D-IC TSV Success
It's time to get to work if we want to bring 3D-ICs with through-silicon vias (TSVs) into the semiconductor design mainstream. What ecosystem support is needed in the short term, medium term, and long term to make this new technology successful? That's the question that was put to a panel of...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Apr 11 2012
DVCon Panel Debate – “Build or Buy” Emulation and Prototyping?
Emulation and FPGA-based prototyping are becoming increasingly necessary for complex systems-on-chip, but where are these hardware-assisted tools going to come from? Should you invest the resources to build and maintain your own, or purchase a commercially available solution? In either case, what do...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Mar 7 2012
Panelists: Bridging the Gap Between Analog and Digital Design
Analog and digital designers have lived in separate worlds for a long, long time. They use different methodologies and tools, and while digital design is heavily automated, analog design is not. But mixed-signal integration will force this gap to narrow, opening the door to new methodologies and better...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Feb 1 2012
GTC Panel: Getting Best Use From Older IC Process Nodes
Time for a mainstream revolution? That was the title of a lively panel discussion at the Global Technology Conference ( GTC ) Aug. 30. Panelists noted that there's still a lot of activity at 65nm and above. They discussed why this is true, whether mature nodes can be retrofitted with new capabilities...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, Sep 5 2011
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