Home > Community > Tags > Industry Insights/ARM
Login with a Cadence account.
Not a member yet?
Create a permanent login account to make interactions with Cadence more conveniennt.

Register | Membership benefits
Get email delivery of the Cadence blog (individual posts).


* Required Fields

Recipients email * (separate multiple addresses with commas)

Your name *

Your email *

Message *

Contact Us

* Required Fields
First Name *

Last Name *

Email *

Company / Institution *

Comments: *

Industry Insights,ARM

  • ARM IP Talks! Keynote: Easing The Path To 32/28 nm

    Will the 32/28 nm process nodes ever go "mainstream," or will costs, complexity, and power problems put these nodes out of reach for all but a handful of users? High-k metal gate technology could make the difference, according to John Heinlein, vice president of marketing for ARM's Physical...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Jun 15 2010
  • Getting IP, Tools, And People “Ready For SOI”

    Last month the SOI Industry Consortium announced a "Ready for SOI Technology" program with initial offerings of silicon-on-insulator IP from ARM, IBM and Cadence. Since interest in SOI appears to be growing for advanced process nodes, I thought it would be a good time to look at what "ready...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Apr 7 2010
  • ARM Keynote: Will ‘Dark Silicon’ Derail The Mobile Internet?

    Dark Silicon sounds like it should be the title of a best-selling thriller novel, and in a way, it is a thriller when it comes to the future of semiconductors. Will advanced nodes produce a huge mass of transistors that will go "dark" because we can't afford to power them? Will all our...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Mar 31 2010
  • ARM AMBA 4 Protocol And VIP – A Closer Look

    ARM last week announced the first phase of its AMBA 4 specification, and Cadence simultaneously released Incisive verification IP (VIP) for the e language and SystemVerilog. So why is ARM releasing AMBA 4, what's in the two phases, and what's in the VIP? To get a closer look at what's in...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Mar 17 2010
  • CES Provides Wake-Up Call for EDA

    Since consumer electronics is the primary driver for IC and systems design, what happens at the Consumer Electronics Show (CES) should interest the EDA community. Any trends in new consumer devices will point the way to design challenges EDA tools will have to solve. From looking at blogs and media coverage...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Jan 11 2010
  • Panelists: 32 nm HKMG Is Ready To Roll

    The 32/28 nm Common Platform high-k metal gate (HKMG) technology is “ready and open for business,” according to the title of a breakfast panel at the ARM Techcon3 conference Oct. 22. Panelists from IBM , ARM and Cadence talked about the benefits of HKMG, the requirements it places on the...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 28 2009
  • Low Power Panel: Looking Back, Looking Forward

    How far have we come with low-power IC design, and where do we need to go from here? Panelists at the Cadence Ecosystem booth at the Design Automation Conference had some compelling answers for both questions Tuesday, July 28. Two panelists were from ASIC design services companies – Faraday Technology...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Aug 17 2009
  • DAC Ecosystem Booth Panels Bring Out User Voice

    At previous Design Automation Conferences, I’ve always been most interested in what EDA users have to say. One way to hear about the user experience at this year’s DAC is to attend any of five panels at the Cadence Ecosystem Partners booth (#4200, North Hall). These panels will include representatives...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Jul 1 2009
  • SystemC Interoperability - Are We There Yet?

    The biggest challenge in system-level design is modeling, and getting SystemC models to work together in simulation environments has been a long, hard struggle. Finally, it appears that the stars are aligned and we are converging on the three things we need for SystemC model interoperability –...
    Posted to Industry Insights (Weblog) by rgoering on Tue, May 19 2009
  • Embedded Software Providers Confront Low Power Design

    I’ve had a nagging question at the last few Embedded Systems Conferences I’ve attended. Why isn’t anyone here – aside from a few silicon vendors – talking about low power design? If you go to any hardware design conference, low-power design will be a major theme, if not...
    Posted to Industry Insights (Weblog) by rgoering on Fri, Apr 3 2009
Page 8 of 8 (80 items) « First ... < Previous 4 5 6 7 8