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Industry Insights,ARM,Double Patterning,20 nm

  • Cadence, Samsung Detail 20nm RTL-to-GDSII Methodology

    In a recently archived May 2 webinar , speakers from Cadence and Samsung described a 20nm digital design methodology that can manage challenges such as double patterning, variability, and complexity. The webinar discussed EDA tools, physical IP, and 20nm process technologies, and it highlighted a "proof...
    Posted to Industry Insights (Weblog) by rgoering on Mon, May 7 2012
  • Cadence, ARM and TSMC Reveal 20nm Challenges and Solutions

    At a recently archived EE Times webinar May 1, representatives of Cadence, ARM and TSMC noted three important points about the 20nm process node. Number one, its adoption is inevitable. Number two, the design and manufacturing challenges are significant. Number three, the challenges are manageable given...
    Posted to Industry Insights (Weblog) by rgoering on Wed, May 2 2012
  • DAC Panel: 20nm is Tough, But Not a Roadblock

    So far the move to lower semiconductor process nodes has continued unabated, but the upcoming 20nm node is causing a lot of concern. Lithography is so challenging that extra masks ( double patterning ) will be required. Will designs be technically and economically feasible? Panelists at the Design Automation...
    Posted to Industry Insights (Weblog) by rgoering on Mon, Jun 6 2011
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