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Industry Insights,28nm,LDE,LEA,design for manufacturability,placement,CCP,Fujitsu

  • “In Design” DFM Signoff – the Inside Story

    As noted in a recent customer announcement with Fujitsu, Cadence offers "in design" design for manufacturability (DFM) signoff for digital, mixed-signal and custom IC design. The basic idea is simple - engineers run signoff DFM checks during the physical design process, instead of waiting until...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 5 2011
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