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IP,28nm,Encounter,Industry Insights

  • TSMC Forum: An Update on 20nm, 3D-IC, and 16nm FinFETs

    TSMC, the world's largest semiconductor foundry, is thinking big when it comes to next-generation process technology. At the TSMC Open Innovation Platform (OIP) Ecosystem Forum Oct. 16, TSMC described reference flows for 20nm and for multi-die integration, and revealed that ARM and TSMC are working...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 17 2012
  • User View: Low Power Challenges at 40nm and Below

    Low power design is hard enough at 65nm and above, and it poses additional challenges at 40nm and below, according to Alex Kuo, department manager at SoC design firm Global Unichip Corp. As noted in another Cadence Community blog post by Qi Wang, Kuo offered a presentation on low-power design at the...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Jun 21 2011
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