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IP,28nm,Cadence

  • TSMC Forum: An Update on 20nm, 3D-IC, and 16nm FinFETs

    TSMC, the world's largest semiconductor foundry, is thinking big when it comes to next-generation process technology. At the TSMC Open Innovation Platform (OIP) Ecosystem Forum Oct. 16, TSMC described reference flows for 20nm and for multi-die integration, and revealed that ARM and TSMC are working...
    Posted to Industry Insights (Weblog) by rgoering on Wed, Oct 17 2012
  • SPIE Papers Showcase DFM and Lithography R&D

    Ten Cadence papers planned for the upcoming SPIE Advanced Lithography conference, set for Feb. 12-16 in San Jose, California, demonstrate recent R&D developments in both "design side" design for manufacturing (DFM) and the computational lithography that takes place during the manufacturing...
    Posted to Industry Insights (Weblog) by rgoering on Thu, Jan 26 2012
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