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A UPF User Perspective on the Evolution of Power Standards
With the recent release of the IEEE 1801-2013 (UPF 2.1) power intent format standard , prospects for "methodology convergence" between the Unified Power Format (UPF) and Common Power Format (CPF) are looking good. One company that has used both formats and is following the evolution of power...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Jun 19 2013
Issue with merging coverage
Hi I finished running a set of simulation tests with coverage, and now I am trying to merge the coverage, but I got the following error. I am able to load individual test, but I can not merge all of them into one. Please let me know what I have to do. Thanks! iccr> merge * -output all iccr: *W,MGURTS...
Posted to
Functional Verification
(Forum)
by
denniscwang
on Tue, Jun 4 2013
Introducing UVM Multi-Language Open Architecture
The new UVM Multi-Language (ML) Open Architecture (OA) posted to the new UVMWorld is the result of a collaboration between Cadence and AMD. It uniquely integrates e , SystemVerilog, SystemC, C/C+, and other languages into a cohesive verification hierarchy and runs on multiple simulators. Moreover, the...
Posted to
Functional Verification
(Weblog)
by
Adam Sherilog
on Fri, May 31 2013
Mixed-signal and Low-power Demo -- Cadence Booth at DAC
0 0 1 556 3170 Cadence Design Systems, Inc. 26 7 3719 14.0 Normal 0 false false false EN-US JA X-NONE /* Style Definitions */ table.MsoNormalTable {mso-style-name:"Table Normal"; mso-tstyle-rowband-size:0; mso-tstyle-colband-size:0; mso-style-noshow:yes; mso-style-priority:99; mso-style-parent...
Posted to
Low Power
(Weblog)
by
QiWang
on Fri, May 31 2013
New Specman Coverage Engine - Extensions Under Subtypes
This is first in a series of three blog posts that are going to present some powerful enhancements that were added to Specman 12.2 in order to ease the modeling of a multi-instance coverage environment. In this blog we're going to focus on the first enhancement, while the other two enhancements will...
Posted to
Functional Verification
(Weblog)
by
teamspecman
on Tue, May 28 2013
DAC 2013: User Perspectives on System-Level Verification
The best way to learn about an emerging technology is to hear from the people who are using it. If you're curious about system-level design and verification, you can do just that at the Cadence System-to-Silicon Verification Breakfast at the Design Automation Conference ( DAC 2013 ) Tuesday, June...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, May 15 2013
A CPF User Perspective on IEEE 1801 (UPF) “Methodology Convergence”
By leveraging Common Power Format (CPF) constructs and removing some older Unified Power Format (UPF) commands, the emerging IEEE 1801-2013 standard (UPF 2.1) will help enable "methodology convergence" with CPF. Kamran Haqqani, principal engineer at Maxim Integrated, will be happy to see this...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Mon, May 13 2013
Mode Support for SimVision “Stop Simulation” Button
Prior to Incisive Enterprise Simulator (IES) 12.1, clicking the SimVision "Stop Simulation" button would stop the simulation both in an HDL context and in a Specman context if Specman was present in the simulation. To provide better flexibility in the exact place where you want to pause, the...
Posted to
Functional Verification
(Weblog)
by
teamspecman
on Wed, May 8 2013
New Incisive Low-Power Verification for CPF and IEEE 1801 / UPF
On May 7, 2013 Cadence announced a 30% productivity gain in the June 2013 Incisive Enterprise Simulator 13.1 release . Advanced debug visualization, faster turn-around time, and the extension of eight years of low-power verification innovation to IEEE 1801/UPF are the key capabilities in the release...
Posted to
Low Power
(Weblog)
by
Adam Sherilog
on Tue, May 7 2013
How Hardware/Software Co-Development Fuels “Product Creation”
I've written recently about "product creation," a concept that looks beyond the chip or board and considers the requirements of the entire end product, including hardware, software applications, and mechanical enclosures. These requirements ripple down through the design supply chain and...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Wed, Apr 3 2013
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