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IC packaging,PCB
"PCB design"
16.6
2.5D
3D
3D-IC
ADRC
advanced node
advanced package designer
ADW
Allegro
Allegro 16.3
Allegro 16.5
Allegro 16.6
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DEHDL
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Design Entry
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Digital SiP design
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Griffin
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IC Packaging and SiP Design
IC/package co-design
Industry Insights
layout
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Library
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OrCAD
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PCB Capture
PCB design
PCB Editor
PCB Layout and routing
PCB PI
PDN
PI
power delivery network
power integrity
SI
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signal integrity
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Sigrity
SiP
SiP Design
SPB
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CDNLive Silicon Valley 2013 Proceedings Available for Download!
CDNLive Silicon Valley, held March 12-13, 2013, featured nearly 100 technical sessions from customers, partners, and Cadence R&D experts. Presentations from most of those sessions are now available on line . Here's your chance to review presentations you heard, catch up on sessions you missed...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Apr 4 2013
What's Good About Allegro Package Designer (APD) Bond Wire "Text In?" You’ll Need the 16.6 Release to See!
Cadence IC Packaging tools today provide a spreadsheet-based import mechanism for die and BGA (standard) components, as well as for importing of netlist updates. In certain design scenarios, particularly for leadframe package designs, it is also desirable to be able to import a similarly formatted file...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Mar 19 2013
Allegro Sigrity Makes its Debut at DesignCon 2013
After Cadence acquired Sigrity in July 2012, we heard many of the same questions: What is happening with my favorite Sigrity tools? Is Cadence going to change the functions and features I’ve been working with several years? If I’m not a Cadence Allegro user, can I continue using Sigrity tools...
Posted to
PCB Design
(Weblog)
by
TeamAllegro
on Tue, Feb 12 2013
What's Good About RF SiP and Data Management? Look to 16.6 and See!
The 16.6 Allegro RF SiP product has 3 major enhancements to improve your productivity. Read on for more details … Data Management of Virtuoso SiP Views In release 16.6, Virtuoso SiP Architect is enhanced to support data management of SiP views through the Virtuoso Library Manager. To enable this...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Dec 4 2012
What's Good About APD’s Shape Shorting? You’ll Need the 16.6 Release to See!
In some designsflows, you need to connect two plane shapes on the same net, but on different layers, together with vias in order to improve connectivity. These “shorting” vias are placed in a regular pattern across the overlapping areas of the shape, in such a way as not to interfere with...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Nov 13 2012
Why Cadence Bought Sigrity – And How it May Change PCB Analysis
On July 2 Cadence announced its acquisition of Sigrity , a provider of signal integrity and power network analysis tools for PCB and IC package design. Cadence already has some technology in these areas, and many Allegro and OrCAD customers use Sigrity tools today. So why buy Sigrity, and why make this...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Jul 12 2012
What's Good About APD’s Wirebond Color Visibility? You’ll Need the 16.5 Release to See!
Prior to the 16.0 release, color and visibility (CV) settings of bond wires in Allegro Package Designer were based on the traditional layer model whereby wires were represented as 2-dimensional cline objects that could be colored and made visible or invisible depending on the layer they were on. In 16...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, May 22 2012
What's Good About APD’s Symbol Editor App Mode? You’ll Need the 16.5 Release to See!
In an IC package design, it is common for the designer to customize the BGA component, or even the die components (if they are still subject to changes by the IC owner) in order to optimize the package substrate for cost and efficiency. In order to do this, changes to the components and physical symbols...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Mar 20 2012
Free Techtorials for Allegro and OrCAD users – PCB Planning, Signal Integrity
If you're an IC packaging or PCB designer, there's a free one-day event just for you at the Cadence San Jose, California headquarters March 15, 2012. Coming one day after CDNLive! Silicon Valley , the event will feature product/technology roadmaps, an interactive roundtable discussion, and half...
Posted to
Industry Insights
(Weblog)
by
rgoering
on Thu, Feb 16 2012
What's Good About APD’s Die Abstract Libraries? You’ll Need the 16.5 Release to See!
In System in Package (SiP) 16.3, the co-design die flow introduced the distributed co-design flow concept, where there is no direct interaction with I/O Planner. Die information flowing between Encounter and SiP Layout is done via a die abstract. In flows up through 16.3, you first need to load the LEF...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Jan 24 2012
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