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IC package technology,SPB 16.2 release

  • EDN blogger talks about Allegro 16.2 release

    Of interest to readers of this forum. An EDN blogger today talks about our SPB 16.2 release. “Cadence is underlining the observation that no longer can we regard PCB design as somehow a simple process, and package design as a mechanical problem,” writes EDN executive Editor Ron Wilson. “With...
    Posted to IC Packaging and SiP Design (Forum) by Dieds on Mon, Aug 18 2008
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