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IC Packaging & SiP design,IDMs

  • TSV, mainstream or niche?

    I'm sure many of you will have read the article in Advanced Packaging click_here where the luminaries at Georgia-Tech talk about how TSV can take us to the next level of functional integration and miniaturization. I have heard several companies (foundries and some iDM's) talking about pilot projects...
    Posted to IC Packaging and SiP (Weblog) by SiPper on Wed, Sep 24 2008
  • Lack of design-chain collaboration prevents SiP to go mainstream

    A few years back, I was considering that the lack of an integrated design solution (tool flow) was the reason that SiP design was an "expert engineering" process -- and why it was not adopted more widely despite its benefits over SoC integration for a broad range of applications and markets...
    Posted to IC Packaging and SiP (Weblog) by Jimmy on Fri, Jul 11 2008
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