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High-Density Interconnect
"PCB design"
Allegro
Allegro 16.3
Allegro 16.5
Allegro PCb
Allegro PCB Editor
Allegro PCB SI
Allegro System Administration
Allegro System Architect (ASA)
AMS simulation
APD
ASA
BGA
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blind vias
buried vias
Capture CIS
CDNLive
Cline change
ConceptHDL
cost
DEHDL
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Design kits
diff pairs
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differential pairs
Drill holes
drill holes DRC
embedded components
Excellon format Database units accuracy NC artwork
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Footprint
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Front-end PCB design
global route
GRE
grids
group routing
Harris
HDI
High Speed
HSPICE
IBIS
IC Packaging
IC Packaging and SiP Design
inner layer
inset vias
interconnects
IPC standards
jumper board
layer stacks
layout
Library and design data management
Manufacturing Data
microvia
miniaturization
NVIDIA
Orcad
OrCAD Capture
orcad capture allegro PCB interactive link
OrCAD PCB Editor
PCB
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pcb editor
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PCB Layout and routing
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SPB
SPB 16.3
SPB16.01
SPB16.3
SPB16.5
staggered vias
TeamAllegro
via
via patterns
via rules
via tangency
vias
What's Good About Allegro PCB Router HDI Capabilities? 16.5 Has a Few New Enhancements!
More high-density interconnect (HDI) improvements including the tuning of the auto-router (Allegro PCB Router - SPECCTRA) to use the via patterns, alignment of via list priority with Allegro PCB Editor, and creation and removal of anti-acid bars are available in the 16.5 release of the Allegro PCB Router...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, May 8 2012
What's Good About Allegro Via Patterns During Group Routing? See for Yourself in 16.5!
New to the 16.5 release of Allegro PCB Editor is the ability to establish via patterns during group routing. Group Routing Review The Allegro PCB Editor supports interactive group routing. Interactive group routing is the routing of more than one net concurrently. You can use this feature when routing...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Mon, Apr 30 2012
What's Good About Allegro GRE Embedded Component Support? It’s in the 16.5 Release!
Just a quick post today … The Allegro Global Route Environment ( GRE ) has been enhanced in the 16.5 release to support embedded components. To expand Allegro's usability in the High Density Interconnect (HDI) environment, GRE has been enhanced to understand Embedded Components . This functionality...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Mar 13 2012
Greeting to all guys here
Hello, guys, it is my first time to know you here. This is Jack from SOPPCB TECHNOLOGY in Shenzhen, China, we are a factory to make PCB fabrication and assembly for nearly 10 years. If any one here need to make PCB boards, pls contact me. Jack soppcbtech at gmail dot com SOPPCB
Posted to
PCB Design
(Forum)
by
SOPPCB
on Fri, Feb 17 2012
What's Good About Allegro PCB Router Inset Vias? See for yourself in 16.5!
Another high density interconnect (HDI) technology that has gained popularity is inset vias. The 16.5 release has provided new commands added in Allegro PCB Router to support inset vias. Via in Pad pattern has been very popular due to its clear advantage of offering lower parasitics as compared to other...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Tue, Jan 10 2012
What's Good About Allegro PCB Router HDI Via Tangency? Check Out 16.5!
High Density Interconnect (HDI) techniques are increasing in the PCB domain. HDI provides the ability to place components on both sides of the board and helps reduce the PCB layer stack. Allegro PCB Router started evolving in this direction from the SPB16.2 version with drill holes and microvias. In...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Wed, Oct 5 2011
Miniaturization Through Embedded Packaged Components
As consumers we are very familiar with product miniaturization trends. We demand more functionality in smaller sizes that have longer battery life all the time. The electronics market has been delivering to those customer expectations not just in consumer electronics marketplace, but in all market segments...
Posted to
PCB Design
(Weblog)
by
hemant
on Tue, May 10 2011
What's Good About Allegro Measure, Grids and Formulas? See For Yourself in SPB16.3!
This week, I’m tossing together a mix of a few new SPB16.3 Allegro PCB Editor features. Show Measure any Layer In the SPB16.3 release, the show measure ( Display — Measure ) command now measures the separation between any two objects regardless of the layer. For padstacks, the active layer...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Wed, Feb 9 2011
What's Good About APD Wire Bonding? SPB16.3 has MANY New Enhancements!
As with every new release, a primary focus for the Allegro Package Designer (APD) PCB IC Packaging tools is the wire bonding capabilities. These are some of the most frequently used, complex, and crucial commands in the tool. As the majority of packages today are still based on wire bond technology,...
Posted to
PCB Design
(Weblog)
by
Jerry GenPart
on Wed, Jan 12 2011
noise environment board simulation
Hi, I am using Cadence allegro PCB SI 16.0. I am doing EMI simulation.My doubt is, Is itpossible to simulate external emi how affeting the board circuitry and also how to make sure that board will work in particular (db) noise enviornment?. In allegro PCB SI 16.0 have any provision to simulate our borad...
Posted to
PCB Design
(Forum)
by
Lingam
on Mon, Mar 2 2009
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