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Floorplanning,Cadence

  • Three Die Stack -- A Big Step “Up” for 3D-ICs with TSVs

    A major advancement in 3D-IC through-silicon via (TSV) design will be unveiled Tuesday (Dec. 13) as representatives of CEA-LETI and ST-Ericsson describe the development of a three-die stack with wide I/O memory and logic. This tapeout is the result of a collaboration between these two organizations and...
    Posted to Industry Insights (Weblog) by rgoering on Tue, Dec 13 2011
  • Re: pin placement around core in encounter

    Hi, You can use editPin command in way to place IO pins on boundary of the block. Just example from documentation (Encounter Digital Implementation System Text Command Reference): Example: The following command modifies the pins as specified here: - the command runs on the module DTMF_CORE_INST1 - the...
    Posted to Digital Implementation (Forum) by mikhail on Tue, Nov 22 2011
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